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Tunnel glue discharging furnace

Precision Binder Removal · Intelligent Control | DeciTech Tunnel Debinding Furnace Empowers Zero-Defect Manufacturing of Piezoelectric Ceramics

As a professional manufacturer of piezoelectric ceramic core components, DeciTech's tunnel debinding furnace is specifically engineered for the debinding and binder removal processes of piezoelectric ceramic green bodies. By integrating gradient temperature control and atmosphere protection technology, it achieves efficient decomposition of binders and residue-free discharge.

The system incorporates an intelligent temperature control system, multi-layer conveyor structure, and exhaust treatment module, ensuring precise and stable binder removal processes that lay a robust quality foundation for subsequent sintering operations.


Tunnel glue discharging furnace

  • 详情介绍

Core Value of Equipment - Building the Quality Foundation for Piezoelectric Ceramics


Gradient Binder Removal · Precision Crack Prevention

● Proprietary "Preheating-Gradual Rise-Constant Release-Gradient Cooling" four-stage thermal control model: Achieves gradient binder decomposition.

● Real-time oxygen content monitoring system (0-1000ppm precision): Eliminates carbonization residue risks.

● Multi-layer mesh belt staggered layout design: Ensures ±2℃ hot air circulation uniformity, reducing product cracking rate by 76%.


Smart IoT · Process Closed Loop

● Process database integration (compatible with 50 recipes): Auto-matches material properties with binder removal curves.

● Remote monitoring terminal: Displays 12 real-time parameters including binder removal rate and exhaust gas concentration.

● Three-level abnormal alarm response (auditory-visual/SMS/automatic shutdown): Fault self-diagnosis accuracy ≥95%.


Energy Efficiency · Green Intelligent Manufacturing

● Waste heat recovery system: 35% energy savings, 42% reduction in exhaust treatment energy consumption.

● Modular furnace structure: Enables rapid model changeover (specification switching completed in 30min).

● MTBF (Mean Time Between Failures) exceeds 8000 hours.


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