The piezoelectric ceramic stack consists of multiple piezoelectric ceramic sheets stacked and bonded together using epoxy resin. These piezoceramic stacks achieve significantly greater free travel than a single piezoceramic chip, while maintaining sub-millisecond response times and a low drive voltage range.
The piezoelectric ceramic plate is composed of ceramic layer and electrode layer, overlapping each other, and the internal electrode is drawn out through the printed electrode on both sides of the outside. The remaining four sides have ceramic insulation layer, good moisture proof effect, and the side ceramic layer is printed with a "cross" pattern as a positive electrode identifier. There is a through hole in the center of the ceramic square, and the inner hole is used for preloading or as the aperture in optical applications (the aperture size can be customized); The displacement of the ceramic chip is 1‰ of its thickness, the standard thickness is 2mm/3mm, the flatness < ±5μm(other thickness customization is supported); Optional solder wire or no solder wire Ideal for dynamic operations Sub-nanometer resolution Microsecond response