Multi-Layer Piezoelectric Bimorph

Multi-Layer Piezoelectric Bimorph

Redefining bending deformation limits with innovative layered composite architecture and advanced materials, this component emerges as the optimal choice for miniaturized high-sensitivity actuation/sensing systems. As professional manufacturers, we ensure reliability and peak performance through stringent process control and scenario-specific customization, empowering technological upgrades in smart devices and precision systems.

Structural Design

● Multi-Layer Composite Architecture: Alternating piezoelectric ceramic and elastic metal layers with optimized polarization/field alignment to amplify bending deformation and force density.

● Symmetrical Polarization: Oppositely polarized adjacent piezoelectric layers generate unidirectional bending under excitation, achieving millimeter-level displacement with reduced driving voltage.

● Lightweight Encapsulation: Ultra-thin epoxy/polyimide protective coating ensures flexibility and fatigue resistance, compatible with curved surfaces and high-frequency vibration environments.

Material Properties

● High-Sensitivity Piezoelectric Material: PZT-based composition with high d31 coefficient (≥320×10^-12 m/V), improving bending mode efficiency by 40%+.

● Enhanced Flexural Strength: Matched thermal expansion coefficients between metal/ceramic layers triple fracture resistance compared to single-layer bimorphs.

● Broadband Frequency Response: Adjustable resonance frequency (100Hz~50kHz) accommodates acoustic/ultrasonic multi-band applications.

Core Advantages

● Large Bending Displacement: 0.5~2mm free-end displacement under low voltage (≤50V), outperforming traditional single-layer bimorphs.

● High-Sensitivity Sensing: μN-level force detection with bidirectional energy conversion for self-powered sensing and energy harvesting.

● Rapid Dynamic Response: <1ms electromechanical response enables real-time haptic feedback and high-frequency acoustic emission.

● Robust Environmental Resistance: Moisture-proof, EMI-resistant, and operable at -25°C~130°C for industrial-grade reliability.

Typical Applications

● Acoustics: Micro-speaker diaphragm actuation, ANC headphone vibration units, ultrasonic atomizers.

● Smart Sensing: Force feedback modules for touchscreens, e-skin pressure sensors, vibration energy harvesters.

● Medical Devices: Portable ultrasound probes, endoscopic scanning actuators, respiratory monitors.

● Industrial Testing: NDT ultrasonic transducers, pipeline crack monitoring exciters.

● Consumer Electronics: OIS mechanisms for smartphone cameras, haptic alert modules in wearables.

Quality Commitment

● Full-Process QC: Monitored lamination strength and polarization uniformity from tape casting to sintering, with 100% bending fatigue and impedance testing.

● Customization Flexibility: Tailored dimensions, resonance frequencies, force/displacement curves, and encapsulation styles, including circuit impedance matching co-design.

● Lifecycle Support: Application simulation, installation guidance, failure analysis, and 24/7 technical consultation to ensure seamless integration and optimized performance.