Piezo Controller DC-C60.MS3

DC-C60.MS3

With triple-channel coordination, SGS closed-loop technology, and ultra-compact dimensions, this controller is ideal for space-sensitive applications like precision optical focusing, micro-positioning stages, and multi-axis systems, delivering reliable technical support for high-density integration.

Structural Design

● Ultra-Compact Triple-Channel Layout: Dimensions 118×103×41mm (excluding mounting ears), weight 0.3kg, supports independent/synchronized 3-channel control for embedded installations.

● Multi-Functional Interfaces: HDB15 (integrated PZT/sensor connection), 3.81 terminal sensor outputs, SMB control inputs, and USB (MicroUSB)/RS422/RS232 communication (DB9).

● Passive Cooling: Fanless design with aluminum housing and thermal conductive structure ensures stable 0–50°C operation without vibration interference.

Material Properties

● High-Speed Processing: 32-bit 168MHz processor and dual 16-bit AD/DA converters enable real-time SGS feedback processing (closed-loop delay ≤5μs).

● EMI-Resistant Construction: Full-metal housing with internal shielding reduces cross-channel interference <0.1%.

● Low-Ripple Power Design: ≤10mVRMS output ripple with 2.2μF capacitive load for high-sensitivity piezoelectric devices.

Core Advantages

● SGS Closed-Loop Servo: Analog P-I + band-stop + low-pass composite algorithm dynamically compensates disturbances, achieving ±0.01%F.S. positioning accuracy.

● Triple-Channel Flexibility: Independent control, synchronized triggering, or cascaded expansion for 3-DOF stages and micro-optical arrays.

● Industrial Safety: Per-channel current limiting (60mA), thermal throttling, and isolated communication interfaces protect devices and loads.

● Plug-and-Play Compatibility: HDB15 integrates PZT drive and sensor feedback, simplifying cabling and deployment.

Typical Applications

● Micro-Positioning Systems: 3-DOF nano stages, micro-robotic joint drives.

● Optical Precision Adjustment: Multi-channel lens focusing, fiber alignment, laser beam shaping.

● Industrial Embedded Integration: MEMS test benches, semiconductor wafer fine-tuning.

● Research & Inspection: Micro-SPM drives, bio-micro-manipulators.

Core Guarantees

● Stringent QC Processes: High-precision SMT and 72-hour thermal aging ensure industrial reliability (MTBF ≥45,000 hours).

● Customization Services: Adjustable gain (12×/15×), communication protocols (CAN/Ethernet), and housing dimensions.

● Lifecycle Support: Closed-loop tuning guides, multi-channel control case studies, and rapid after-sales response to simplify integration.