1. If the piezoelectric ceramic sheet has been bonded to the copper sheet, what should be done? In addition, how to choose the package?
For problem 1, the solution is very simple. Just test whether the Curie temperature of the piezoelectric ceramic sheet exceeds 400 degrees. If it exceeds, the piezoelectric performance will disappear. At this time, you can bond the wire joints with conductive glue on the surface of the piezoelectric ceramic sheet, then weld the joints of the copper sheet. For the latter question, it is necessary to consider its specific use needs, then determine the specific packaging form.
2. Is there a difference between a piezoelectric ceramic chip a ceramic capacitor?
Piezoelectric ceramic chips ceramic capacitors, these two, a professional point of view, are somewhat different, although they are much different in material structure. However, there is still a certain difference in the stress deformation of the medium. Therefore, there cannot be an equal sign between the two.
3. How to combine piezoelectric ceramic sheet with metal well?
In this case, under normal circumstances, the piezoelectric ceramic sheet is bonded to the metal through epoxy resin, basically without glue. However, using glue is also ok. It should be noted that the glue should be applied by screen printing dispensing. In addition, the glue must be completely cured, it must be pressed tightly during the curing process so as to affect the performance of the piezoelectric ceramic sheet.